Our ESD Foam is closed cell and cross linked material. The cells get opened during the milling process and can create a FOD condition by exposing a rough edge with small pieces that could break off. Heat will seal the edge and eliminate the FOD condition. OSAAP America heat treats our ESD foam a heat gun set at 1000°F before shipment.
Picture #1: Close-up before heat process
Picture #2 Close-up after heat process
Picture #3 Full board after heat process